Kim Myung hoi 사진
Kim Myung hoi
Position
Associate Professor
Phone
031-670-5295
Email
mhkim80@hknu.ac.kr
Homepage
Major
Microwave/mmWave circuits, EMI/EMC
Room
Engineering Hall 2 Building #218

Detail

* Education

- KAIST


*연구실적및 저서

- M. Kim and D. G. Kam, “Wideband and Compact EBG Structure with Balanced Slots,” IEEE Trans. Compon. Packag. Manufac. Tech., Vol. 5, no. 6, pp. 818-827, June., 2015.

- M. Kim, “A Compact EBG Structure with Wideband Power/Ground Noise Suppression using Meander-Perforated Plane,” IEEE Trans. Electromagn. Compat, Vol. 57, no. 3, pp. 595-598, June, 2015.

- M. Kim and D.G. Kam, “A Wideband and Compact EBG Structure With a Circular Defected Ground Structure,” IEEE Trans. Compon. Packag. Manufac. Tech., Vol. 4, no. 3, pp. 496-503, Mar., 2014.

- M. Kim, S. Kim, B. Bae, J. Cho, J. Kim, and D. S. Ahn, “Application of VSI-EBG Structure to High-Speed Differential Signals for Wideband Suppression of Common-Mode Noise,” ETRI J., Vol. 35, no. 5, Oct., 2013.

- M. Kim, K. Koo, Y. Shim, C. Hwang, J. S. Pak, S. Ahn, and J. Kim, “Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multi-layer PCBs,” IEEE Trans. Electromagn. Compat., Sep., 2012.

- M. Kim, K. Koo, J. Kim, and J. Kim, “Vertical Inductive Bridge EBG (VIB-EBG) Structure with Size Reduction and Stopband Enhancement for Wideband SSN Suppression,” IEEE Microw. Wireless Compon. Lett., Vol. 22, no. 8, pp. 403-405, Aug., 2012.

- M. Kim, K. Koo, C. Hwang, Y. Shim, J. Kim, and J. Kim, “A Compact and Wideband Electromagnetic Bandgap Structure using a Defected Ground Structure for Power/Ground Noise Suppression in Multi-layer Packages and PCBs,” IEEE Trans. Electromagn. Compat., Vol. 54, no. 3, pp. 689-694, June, 2012.

- H. Kim, J. Cho, M. Kim, K. Kim, J. Lee, H. Lee, K. Park, K.-S. Choi, H.-C. Bae, J. Kim, and J. Kim, “Measurement and Analysis of a High-Speed TSV Channel,” IEEE Trans. Compon. Packag. Manufac. Tech., Vol. 2, no. 10, pp. 1672-1685, Oct., 2012. 

- M. Shin, M. Kim, J. Kim, J. Kim, and S. Ahn, “Small-Size Low-Cost Wideband Continuous-Time Linear Passive Equalizer With an Embedded Cavity Structure on a High-Speed Digital Channel,” IEEE Trans. Compon. Packag. Manufac. Tech., Vol. 4, no. 1, pp. 94-99 Jan., 2014.

- K. Koo, M. Kim, J. Kim, J. Kim, and J. Kim, “Vertical Noise Coupling from On-chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3D-IC,” IEEE Trans. Compon. Packag. Manufac. Tech., Vol. 3, no. 3, pp. 476-488 Mar., 2013.

- C. Hwang, Y. Shim, K. Koo, M. Kim, J. S. Pak, and J. Kim, “An On-Chip Electromagnetic Bandgap Structure using an On-Chip Inductor and a MOS Capacitor,” IEEE Microw. Wireless Compon. Lett., Vol. 21, no. 8, pp. 439-441, Aug. 2011.